OS2404 結晶塑性を考慮したCu微細接合部の局所ひずみ解析(OS24-2 三次元積層半導体チップにおけるシリコン貫通ビア/微細金属接合技術と強度信頼性,OS-24 三次元積層半導体チップにおけるシリコン貫通ビア/微細金属接合技術と強度信頼性)

概要

論文の詳細を見る
A copper (Cu) micro-interconnection, which connects through-hole electrodes in a three-dimensional chip stacking LSI, is composed of several tens of grains. The crystal grain property influences on mechanical reliability if the size of the interconnection becomes small in comparison with the grain. In this study, the strain distribution in the Cu micro-interconnection is investigated by using the elastic-plastic FEM analysis. The FEM analysis shows that the high plastic strain area is located around the center of the micro-interconnection in consequence of the macroscopic structure. The size of the high strain area vary according to the effect of the crystal grain property, and the variability of the size of the high strain area follows the normal distribution independently of the measure of the strain.
一般社団法人日本機械学会の論文
2011-07-16