OS1608 異材界面を有するナノ構造体の変形と破壊(OS16-2 微視的な視点からの変形と強度,OS-16 ナノ・マイクロの視点からの変形と破壊の力学)

概要

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The purpose of this work is to examine the effect of microscopic structure on the mechanical property in nano-component. Special shape of a designed thin specimen enables us to conduct an in-situ transmission electron microscope (TEM) observation on the plasticity and interfacial cracking. TEM images exhibit initial plastic deformation with high critical resolved shear stress (400-420 MPa) in the Cu film, and preferential development of plastic deformation only in one grain. Interfacial cracking occurs at the intersection between the grain boundary and the Cu/Si interface. Stress analysis proves that the characteristic behavior in the nano-component is governed by the microscopic stress field taking into account the crystallographic structure.
一般社団法人日本機械学会の論文
2011-07-16