球圧子埋込みによる薄膜・基板接合体の応力分布の有限要素解析 : 薄膜および界面のミクロ破壊との関連において

概要

論文の詳細を見る
In order to investigate a method for evaluating the fracture strength of a film itself and the interface of a film-substrate system by means of indentation of a sphere, a finite-element analysis was carried out and the stress distribution was obtained. The analysis was made by assuming an elliptically distributed contact pressure. This assumption is almost valid within the range of parameters used in the present analysis. The ratio of the film thickness to the radius of the contact circle and the elastic properties of the film were varied. Dependences of the stresses relevant to microfracture of the film and the interface on the relative thickness and the elastic properties of the film were revealed. The results are useful in predicting and understanding the microfracture behavior of a film-substrate system.
社団法人日本機械学会の論文
1992-02-25