弾性球圧子押込みによる薄膜・基板接合体の接触圧分布 : 薄膜の機械的特性評価を目的として

概要

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In order to improve the mechanical reliability of devices in which thin films are used, it is important to investigate the fundamental aspects of the mechanical properties of thin films and also to establish methods for their evaluation. This paper is concerned with indentation by a spherical indenter for quantitative evaluation of interfacial fracture resistance of the film-substrate and fracture strength of a thin film itself. An elastic stress analysis was carried out for indentation by an elastic sphere of a film-substrate system by means of FEM, and whether or not the contact pressure profile can be regarded as elliptical was examined. The influence of elastic properties of the indenter, the film and the substrate on the pressure profile, the maximum pressure and the contact radius was also investigated.
社団法人日本機械学会の論文
1992-02-25