球圧子押込みによる薄膜・基板接合体の応力分布の弾塑性有限要素解析 : 薄膜の破壊強度評価を目的として

概要

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In electronic devices, magnetic disks and micromechanical systems, thin films are widely used. Improvement of their mechanical reliability requires invetigations of methods for evaluating fracure strength of thin films coated on substrates. In order to develop a method for evaluation of fracture strength by means of indentation with a small spherical indenter, an elasto-plastic finite-element stress analysis for the case of an elastic film and a plastic substrate is carried out in this paper. The analysis shows that radial tensile stress or occurs in the film beyond the contact area. An approximate equation for the distribution of σ_r is derived, which is useful for evaluation of the fracture strength.
社団法人日本機械学会の論文
1994-02-25