Effects of Hot Carriers on DC and RF Performances of Deep Submicron p-Channel Metal–Oxide–Semiconductor Field-Effect Transistors with Various Oxide Layer Thicknesses
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概要
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In this work, the effects of hot carriers on the DC and RF performances of 45 nm p-channel metal–oxide–semiconductor field-effect transistors (PMOSFETs) with various oxide layer thicknesses were investigated in detail by RF automatic measurements. It was found that a PMOSFET with a thinner oxide layer suffers more serious damage from hot carriers than that with a thicker oxide layer. Also, the greatest degradation occurs at the bias condition when gate stress voltage $V_{\text{gstr}}$ is equal to drain stress voltage $V_{\text{dstr}}$, and it was found that the degradation of the cutoff frequency $ f_{\text{T}}$ is dependent on transconductance $g_{\text{m}}$ only. This is different from conventional long-channel devices, in which the greatest degradation takes place at $V_{\text{gstr}} = V_{\text{dstr}}/2$ and when $ f_{\text{T}}$ is dependent on both $g_{\text{m}}$ and the total gate capacitance $C_{\text{gg}}$ ($=C_{\text{gs}}+C_{\text{gd}}$).
- 2008-04-25
著者
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Fang Yean-kuen
Vlsi Technology Lab. Institute Of Microelectronics Ee Department National Cheng Kung University No.
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Tang Mao-chyuan
Vlsi Technology Laboratory Institute Of Microelectronics Department Of Electrical Engineering Nation
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Liao Wen-Shiang
Advanced Technology Development Division, United Microelectronics Corp., Tainan 741, Taiwan
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Fang Yean-Kuen
VLSI Technology Laboratory, Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan
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Chen David
Advanced Technology Development Division, United Microelectronics Corp., Tainan 741, Taiwan
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Yeh Chune-Sin
Advanced Technology Development Division, United Microelectronics Corp., Tainan 741, Taiwan
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Chien Shan-Chieh
Advanced Technology Development Division, United Microelectronics Corp., Tainan 741, Taiwan
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