Non-destructive Analysis of Buried Interfaces and Surface Layers: X-Ray Emission Spectroscopic Study
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概要
- 論文の詳細を見る
Soft X-ray emission spectroscopy (SXES) and extended X-ray emission fine structure (EXEFS) studies have been carried out on a heat-treated thin-film(Ni)/substrate(Si, SiC) contact system using a conventional X-ray micro-analysis (XMA) apparatus. We have successfully deduced information either the chemical bonding or atomic configuration by the former and the latter, respectively. Also, we have succeeded in analyzing an interface buried rather deep below an overlayer, e.g., more than a hundred nm. This is due to the fact that both an X-ray production depth of an energetic electron is much larger than the mean free path of an energetic electron and the mean free path of an X-ray photon in a solid is large. Namely, in the surface, or interface layer, Ni2Si and NiSi2 formation have been clarified for heat-treated Ni/SiC and Ni/Si systems, respectively.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2003-07-15
著者
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Hirai Masaaki
Research Laboratory For Surface Science Faculty Of Science Okayama University
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MORII Takashi
Research Institute of Biomolecule Metrology Co. Ltd.
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Iwami Motohiro
Reseach Laboratory For Surface Science Faculty Of Science Okayama University
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Kusaka Masahiko
Research Laboratory For Surface Science Faculty Of Science Okayama University
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Iwami Motohiro
Research Laboratory for Surface Science, Faculty of Science, Okayama University, Okayama 700-8530, Japan
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Kusaka Masahiko
Research Laboratory for Surface Science, Faculty of Science, Okayama University, Okayama 700-8530, Japan
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Morii Takashi
Research Institute of Biomolecule Metrology Co. Ltd., Tsukuba 305-0853, Japan
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