423 高密度集積化に適した表面加工型マイクロ流体集積回路の形成と評価(T09-1 微小機械システムにおけるマイクロ・ナノ力学(1) MEMSにおけるマイクロ・ナノ力学,大会テーマセッション,21世紀地球環境革命の機械工学:人・マイクロナノ・エネルギー・環境)

概要

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In this paper, a new technology to form micro fluidic integrated circuit using a new structure of micro fluidic transistor is presented for high density integration. Surface micromachining using Deep-RIE is applied to form the vertical moving diaphragm structure which modulates the channel conductance of the fluidic transistors. Vertical diaphragm with around 3.4μm thickness and 100μm width were formed by BOSCH process using 100μm-thick active layer of SOI substrate. Using the vertical structure in fluidic transistors, the device area is reduced to 1/10 of that of the previous fluidic transistors. High density integration of fluidic integrated circuit has been possible by the new structure of transistors. Various kinds of micro fluidic integrated circuits were fabricated by a simple fabrication process with 3 steps of photolithography. As a result, diode rectifying characteristic of a fluidic transistor was obtained. Also, operation of an integrated pressure inverting amplifier using the new fluidic transistors has been confirmed experimentally for the first time. This technology is very promising to realize highly functional fluidic integrated circuits.
社団法人日本機械学会の論文
2008-08-02