1116 自動位置決めによる表面実装素子のウェハレベル搭載技術と無線駆動マイクロセンサデバイスへの適用(要旨講演,マイクロメカトロニクス)

概要

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In this study, a novel technique of wafer-level automatic integration of Surface Mount Devices (SMD) on silicon microchips and its application to ubiquitous microsensor devices are presented. One of the important problems in networked sensing systems is power supplying method to each sensor node in the sensing system. We have proposed fully wireless silicon microsensor node driven by RF power transmission for realization of battery-less power supply system in ubiquitous sensor networks. Integrating large capacitor by SMD technology with ubiquitous sensor microchip, the maximum drive capability and the efficiency of the on-chip power receiver (RF-DC converter) for total system drive is so much increased. Self-assembly of SMD on silicon-wafer can be automatically performed by means of both gravity force and vibration. The concept, experimental results, and an application example to RF-powered circuit are presented.
2007-03-19