異方性導電樹脂を用いたフリップチップ接合部の耐吸湿リフロー設計(J01-2 微細接続信頼性,J01 エレクトロニクス実装における熱制御および信頼性評価)

概要

論文の詳細を見る
Anisotropic Conductive Adhesive Film (ACF) has been used for electronic assemblies such as the connection between a Liquid Crystal Display (LCD) panel and a flexible print circuit board (FPC). Recently, the ACF is expected to be a key technology for flip chip packaging and SiP (system in packaging). The goal of our work is to provide an optimum design scheme to achieve the best combination of electrical performance and mechanical reliability for electronic packages using the ACF. The stress intensity factors of an interface crack between jointed dissimilar materials were, utilized for the evaluation of the delamination occurred in a flip chip connected by the ACF under moisture/reflow sensitivity tests.
一般社団法人日本機械学会の論文
2004-09-04