Room-Temperature Bonding of Si Wafers to Pt Films on SiO_2 or LiNbO_3 Substrates Using Ar-Beam Surface Activation
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 1999-12-15
著者
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Takagi Hideki
Mechanical Engineering Laboratory Agency Of Industrial Science And Technology Ministry Of Internatio
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Suga Tadatomo
Research Center For Advanced Science And Technology University Of Tokyo
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Suga T
Research Center For Advanced Science And Technology University Of Tokyo
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Maeda R
National Inst. Advanced Industrial Sci. And Technol. Ibaraki Jpn
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Takagi H
Mechanical Engineering Laboratory Agency Of Industrial Science And Technology Ministry Of Internatio
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Takagi H
Murata Manufacturing Co. Ltd. Kyoto Jpn
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MAEDA Ryutaro
Mechanical Engineering Laboratory, Agency of Industrial Science and Technology, Ministry of Internat
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HOSODA Naoe
Research Center for Advanced Science and Technology, University of Tokyo
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Hosoda Naoe
Research Center For Advanced Science And Technology University Of Tokyo
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Hosoda Naoe
Research Center For Advanced Science And Technology The University Of Tokyo
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Suga Tadatomo
Research Center For Advanced Science And Technology (rcast) The University Of Tokyo
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Maeda Ryutaro
Mechanical Engineering Laboratory
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Maeda Ryutaro
Mechanical Engineering Laboratory Agency Of Industrial Science And Technology Ministry Of Internatio
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