Low-Resistivity Contact of YBa_2Cu_3O_<7-x>/Al Joint Bonded at Room Temperature
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概要
- 論文の詳細を見る
A joining between YBa_2Cu_3O_<7-x> and aluminum was performed at room temperature employing the surface activation method. After surfaces of both samples were sputter-cleaned by an argon beam in vacuum, activated surfaces were pressed to each other at the pressure of 96 MPa. Although the surface of YBa_2Cu_3O_<7-x> was very rough, a tight joint was obtained. Interface resistance of the joint was measured by the four-probe method. It decreased as temperature was lowered and it was as low as 6×10^<-9> Ω・m^2 at 77 K. V-I measurement demonstrated, however, that it did not show an exactly ohmic character, but a slight positive dependence on current.
- 社団法人応用物理学会の論文
- 1991-12-01
著者
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TAKAHASHI Yutaka
Research Center for Advanced Science and Technology (RCAST), The University of Tokyo
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Suga Tadatomo
Research Center For Advanced Science And Technology (rcast) The University Of Tokyo
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Takahashi Yutaka
Research Center For Advanced Science And Technology University Of Tokyo
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Hosomi Eiichi
Research Center For Advanced Science And Technology University Of Tokyo
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