Feasibility of Direct Bonding Between CMP-Cu Films at Room Temperature for Bumpless Interconnect
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概要
- 論文の詳細を見る
- 2001-09-25
著者
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Suga Tadatomo
Research Center For Advanced Science And Technology The University Of Tokyo
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Hosoda Naoe
Research Center For Advanced Science And Technology The University Of Tokyo
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ITOH Toshihiro
Research Center for Advanced Science and Technology, The University of Tokyo
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Suga Tadatomo
Research Center For Advanced Science And Technology (rcast) The University Of Tokyo
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Itoh Toshihiro
Research Center For Advanced Science And Technology (rcast) The University Of Tokyo
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Itoh Toshihiro
Research Center For Advanced Science And Technology The University Of Tokyo
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SHIGETOU Akitsu
Research Center for Advanced Science and Technology, The University of Tokyo
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Shigetou Akitsu
National Institute For Materials Science (nims)
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Shigetou Akitsu
Research Center For Advanced Science And Technology The University Of Tokyo
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