Mechanism for AlSiCu Alloy Corrosion

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Developments of plasma etching technology for fabricating semiconductor devices
SiO_2 Etching Characteristics with Low-Energy Ions Generated by Electron Cyclotron Resonance Plasma Using CF_4 and NF_3 Gases
High Performance Electron Cyclotron Resonance Plasma Etching with Control of Magnetic Field Gradient : Etching
High Performance Electron Cyclotron Resonance Plasma Etching with Control of Magnetic Field Gradient
Highly Selective AlSiCu Etching Using BBr_3 Mixed-Gas Plasma : Etching and Deposition Technology
ECR Plasma Etching with Heavy Halogen Ions : Etching and Deposition Technology
Highly Selective AlSiCu Etching Using BBr_3 Mixed-Gas Plasma
ECR Plasma Etching with Heavy Halogen Ions
Effect of Electron Shading on Gate Oxide Degradation
Reduction of Charge Build-Up with Pulse-Modulated Bias in Pulsed Electron Cyclotron Resonance Plasma
Influence of Puled Electron Cyclotron Resonance Plasma on Gate Electrode Etching
Reduction of Charge Build-up with High-Power Pulsed Electron Cyclotron Resonance Plasma
Evaluation of Electron Shading Charge Buildup Damage Using Metal-Nitride-Oxide-Silicon Capacitors
Etching Characteristics of WSi_2 with Pulsed-Electron Cyclotron Resonance Plasma
Precise Evaluation of Pattern Distortion with Variation of the Impurity Concentration and Conductivity of Silicon Films
SiO_2 Etching in C_4F_8/O_2 Electron Cyclotron Resonance Plasma
Analysis of Fluorocarbon Deposition during SiO_2 Etching
Pulsed Plasma Processing for Reduction of Profile Distortion Induced by Charge Buildup in Electron Cyclotron Resonance Plasma
Profile Control of poly-Si Etching in Electron Cyclotron Resonance Plasma
Mechanism of Reactive Ion Etching Lag in WSi_2 Etching Using Electron Cyclotron Resonance Plasma
Effect Plasma Transport on Etched Profiles with Surface Topography in Diverging Field Electron Cyclotron Resonance Plasma
Photolithography System Using Annular Illumination : Photolithography
Photolithography System Using Annular Illumination
Transformation of Dense Contact Holes during SiO_2 Etching
Effects of Charge Build-up of Underlying Layer by High Aspect Ratio Etching
Electron Beam Direct Writing Technologies for 0.3-μm ULSI Devices : Lithography Technology
Electron Beam Direct Writing Technologies for 0.3-μm ULSI Devices
An Application of a Flip-Chip-Bonding Technique to GHz-Band SAW Filters for Mobile Communication (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functioions and Size-Reductions)
Microwave Characteristics of Alumina-Glass Composite Multi-Layer Substrates with Co-fired Copper Conductors (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functioions and Size-Reductions)
Low-Temperature Reactive Ion Etching for Multi-Layer Resist (Special Issue on Sub-Half Micron Si Device and Process Technologies)
Mechanism for AlSiCu Alloy Corrosion
Temperature Dependence of Gain Characteristics in 1.3-μm AlGaInAs/InP Strained Multiple-Quantum-Well Semiconductor Lasers (Joint Special Issue on Recent Progress in Optoelectronics and Communications)
Temperature Dependence of Gain Characteristics in 1.3-μm AlGaInAs/InP Strained Multiple-Quantum-Well Semiconductor Lasers (Joint Special Issue on Recent Progress in Optoelectronics and Communications)
An 80-MOPS-Peak High-Speed and Low-Power-Consumption 16-b Digital Signal Processor
A 16-bit Digital Signal Processor with Specially Arranged Multiply-Accumulator for Low Power Consumption
Crystal Growth and Magnetic Properties of SmFe_2
Magnetic Anisotropy of New Intermetallic Compound SmFe_7
Magnetic Properties of SmFe_3 Single Crystal
Mechanism of AlCu Film Corrosion
Profile Distortion Caused by Local Electric Field in Polysilicon Etching
Influence of Poly-Si Potential on Profile Distortion Caused by Charge Accumulation
Analyses on Monolithic InP HEMT Resistive Mixer Operating under Very Low LO Power
Automated Millimeter-Wave On-Wafer Testing System (Special Issue on Microwave and Millimeter Wave Technology)
Highty Selective Contact Hole Etching Using Electron Cyclotron Resonance Plasma
A 600 mW Single Chip MPEG2 Video Decoder
Electron Scattering from Si Surface and Interface by Cross-Sectional Transmission Electron Microscopy

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