Microwave Characteristics of Alumina-Glass Composite Multi-Layer Substrates with Co-fired Copper Conductors (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functioions and Size-Reductions)
スポンサーリンク
概要
- 論文の詳細を見る
This paper presents ceramic multi-layer substrates for mobile communication using alumina-glass composite ceramics and co-fired copper conductors. Electrical characteristics in GHz frequencies of the substrate, copper conductor, transmission line, via hole and coupling between the striplines were evaluated. The results showed that the ceramic multi-layer substrate had good electrical characteristics enough for GHz-band applications. Using the ceramic multi-layer substrates, one can drastically reduce the size of RF circuit boards for mobile communication equipment.
- 社団法人電子情報通信学会の論文
- 1993-06-25
著者
-
Ishida Toru
Materials And Components Research Laboratory Matsushita Electric Industrial Co. Ltd.
-
Ishikawa Tsutomu
Fujitsu Laboratories Lid.
-
Taguchi Yutaka
Materials and Components Research Laboratory, Matsushita Electric Industrial Co., Ltd.
-
Eda Kazuo
Materials and Components Research Laboratory, Matsushita Electric Industrial Co., Ltd.
-
Miyauchi Katsuyuki
Materials and Components Research Laboratory, Matsushita Electric Industrial Co., Ltd.
-
Ishida T
Osaka Prefecture Univ. Sakai‐shi Jpn
-
Eda K
Graduate School Of Science And Technology Kobe University
-
Ishikawa T
Microwave Device Development Department Mitsubishi Electric Corporation
-
Taguchi Yohei
The Department Of Mechatronics And Precision Engineering Tohoku University
-
Miyauchi Katsuyuki
Materials And Components Research Laboratory Matsushita Electric Industrial Co. Ltd.
関連論文
- An Application of a Flip-Chip-Bonding Technique to GHz-Band SAW Filters for Mobile Communication (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functioions and Size-Reductions)
- Microwave Characteristics of Alumina-Glass Composite Multi-Layer Substrates with Co-fired Copper Conductors (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functioions and Size-Reductions)
- Low-Temperature Reactive Ion Etching for Multi-Layer Resist (Special Issue on Sub-Half Micron Si Device and Process Technologies)
- Mechanism for AlSiCu Alloy Corrosion
- Temperature Dependence of Gain Characteristics in 1.3-μm AlGaInAs/InP Strained Multiple-Quantum-Well Semiconductor Lasers (Joint Special Issue on Recent Progress in Optoelectronics and Communications)
- Temperature Dependence of Gain Characteristics in 1.3-μm AlGaInAs/InP Strained Multiple-Quantum-Well Semiconductor Lasers (Joint Special Issue on Recent Progress in Optoelectronics and Communications)
- An 80-MOPS-Peak High-Speed and Low-Power-Consumption 16-b Digital Signal Processor
- A 16-bit Digital Signal Processor with Specially Arranged Multiply-Accumulator for Low Power Consumption
- Analyses on Monolithic InP HEMT Resistive Mixer Operating under Very Low LO Power
- Automated Millimeter-Wave On-Wafer Testing System (Special Issue on Microwave and Millimeter Wave Technology)
- Direct Bonding of LiTaO_3 Single Crystals
- Hydrothermal Synthesis and Calorimetric Study of Blue Molybdenum Bronze, K_MoO_3
- Calorimetric Study of Hydrated Potassium Molybdenum Bronze
- Organic Substrate and Flip-Chip Bonding on It Technology, "Chip on ALIVH" Suitable for GHz System Packaging
- Spin-Glass Behavior of Hydrogen Molybdenum Bronze, H_xMoO_3
- New Family Member of Hydrogen Molybdenum Bronze, H_xMoO_3
- Structural Reconstruction by Selective Extraction of Specific Species : Non-reductive Change from h_MoO_3 to H_MoO_3
- Proton NMR study of the lowest-hydrogen-content molybdenum bronze H0.26MoO3
- Hydrothermal synthesis of potassium molybdenum oxide bronzes: structure-inheriting solid-state route to blue bronze and dissolution/deposition route to red bronze
- Transition metal tetramolybdate dihydrates MMo4O13・2H2O (M=Co,Ni) having a novel pillared layer structure
- Crystal structure of cobalt molybdate hydrate CoMoO4・nH2O
- Structure-inheriting solid-state reactions under hydrothermal conditions
- A 600 mW Single Chip MPEG2 Video Decoder
- Basic Studies of Fiber-Optic MEMS for Telecommunication Using Three Dimensional Micromachining(Special Issue on Integrated Systems with New Concepts)