Direct Bonding of LiTaO_3 Single Crystals
スポンサーリンク
概要
- 論文の詳細を見る
A new fabrication method for combining lithium tantalate single crystals by direct bonding without using bonding agents has been developed. The bonded interface was found to be very uniform, and bonding on an atomic scale was achieved in spite of a relatively low heat-treatment temperature of 350℃. This method is very promising for realizing new stacked structures and new fabrication processes for piezoelectric and electrooptic devices, such for a layer of ferroelectric single crystal on insulator or semiconductor.
- 社団法人応用物理学会の論文
- 1994-11-01
著者
-
Eda Kazuo
Materials and Components Research Laboratory, Matsushita Electric Industrial Co., Ltd.
-
Eda Kazuo
Materials And Devices Laboratory Matsushita Electric Industrial Co. Ltd.
-
TOMITA Yoshihiro
Materials and Devices Laboratory, Matsushita Electric Industrial Co., Ltd.
-
SUGIMOTO Masato
Materials and Devices Laboratory, Matsushita Electric Industrial Co., Ltd.
-
OKANO Tetsuyuki
Matsushita Technoresearch Inc.
-
Sugimoto Masato
Materials And Devices Laboratory Matsushita Electric Industrial Co. Ltd.
-
Okano T
Matsushita Technoresearch Inc.
-
Tomita Yoshihiro
Materials And Devices Laboratory Matsushita Electric Industrial Co. Ltd.
関連論文
- An Application of a Flip-Chip-Bonding Technique to GHz-Band SAW Filters for Mobile Communication (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functioions and Size-Reductions)
- Microwave Characteristics of Alumina-Glass Composite Multi-Layer Substrates with Co-fired Copper Conductors (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functioions and Size-Reductions)
- Direct Bonding of LiTaO_3 Single Crystals