An Application of a Flip-Chip-Bonding Technique to GHz-Band SAW Filters for Mobile Communication (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functioions and Size-Reductions)
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概要
- 論文の詳細を見る
We applied a filip-chip-bonding technique to GHz-band SAW filters. The SAW filters mounted by the stud-bump-bonding (SBB) technique which is a kind of flip-chip-bonding technique showed almost the same frequency characteristics as those mounted by the conventional wire-bonding technique at 1.5 GHz. The SAW filter configuration, fabrication process using the SBB, and its electrical characteristics are described and discussed. The SBB technique has a lot of potential to reduce the size and weight even above GHz frequencies.
- 社団法人電子情報通信学会の論文
- 1993-06-25
著者
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Ishida Toru
Materials And Components Research Laboratory Matsushita Electric Industrial Co. Ltd.
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Ishikawa Tsutomu
Fujitsu Laboratories Lid.
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Onishi Keiji
Materials and Components Research Laboratory, Matsushita Electric Industrial Co., Ltd.
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Seki Shun-ichi
Materials and Components Research Laboratory, Matsushita Electric Industrial Co., Ltd.
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Taguchi Yutaka
Materials and Components Research Laboratory, Matsushita Electric Industrial Co., Ltd.
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Bessho Yoshihiro
Materials and Components Research Laboratory, Matsushita Electric Industrial Co., Ltd.
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Eda Kazuo
Materials and Components Research Laboratory, Matsushita Electric Industrial Co., Ltd.
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Ishida T
Osaka Prefecture Univ. Sakai‐shi Jpn
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Eda K
Graduate School Of Science And Technology Kobe University
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Onishi Keiji
Materials And Components Research Laboratory Matsushita Electric Industrial Co. Ltd.
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Ishikawa T
Microwave Device Development Department Mitsubishi Electric Corporation
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Seki Shun-ichi
Materials And Components Research Laboratory Matsushita Electric Industrial Co. Ltd.
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Taguchi Yohei
The Department Of Mechatronics And Precision Engineering Tohoku University
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BESSHO Yoshihiro
Matsushita Electric Industrial Co., Ltd., Device Engineering Development Center
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Bessho Yoshihiro
Matsushita Electric Industrial Co. Ltd. Device Engineering Development Center
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