A 600 mW Single Chip MPEG2 Video Decoder
スポンサーリンク
概要
- 論文の詳細を見る
This paper describes a 600 mW single-chip MPEG2 video decoder, implemented in a 0.5 μm triple metal CMOS technology, which operates with a 3.3-volt power supply. To achieve low power consumption, a low power dual-port RAM has been developed utilizing a selective bit line precharge scheme to reduce bit line current which is suitable for use in the bit-slice array commonly found in parametric ASIC RAM macro modules. This architecture and a non-DC current sense amp make the RAM's read power consumption one-third of that of a conventional dual-port RAM. Various techniques such as multiple-clock architecture and a system clock independent from a display clock make a system clock frequency as low as possible. The video decoder has a syntax parser, so that it can handle the higher syntactic elements of MPEG2 bit streams without any host processor and decode the Main profile at Main level of MPEG2 bit streams.
- 社団法人電子情報通信学会の論文
- 1995-12-25
著者
-
Ishida Toru
Materials And Components Research Laboratory Matsushita Electric Industrial Co. Ltd.
-
Miura Kiyoshi
Research Center Sony Corp.
-
Ishikawa Tsutomu
Fujitsu Laboratories Lid.
-
Ishikawa Toshihiro
The Telecom Research Lab. Matsushita Communication Ind. Co. Ltd.
-
Ishida T
Osaka Prefecture Univ. Sakai‐shi Jpn
-
Ishikawa T
Microwave Device Development Department Mitsubishi Electric Corporation
-
Koyanagi Hideki
Research Center, Sony Corp.
-
Sumihiro Hiroshi
Research Center, Sony Corp.
-
Emoto Seiichi
Research Center, Sony Corp.
-
Ozaki Nozomu
Semiconductor Company, Sony Corp.
-
Ishikawa Toshiro
Semiconductor Company, Sony Corp.
-
Emoto Seiichi
Research Center Sony Corp.
-
Sumihiro Hiroshi
Research Center Sony Corp.
-
Koyanagi Hideki
Research Center Sony Corp.
-
Ozaki Nozomu
Semiconductor Company Sony Corp.
関連論文
- An Application of a Flip-Chip-Bonding Technique to GHz-Band SAW Filters for Mobile Communication (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functioions and Size-Reductions)
- Microwave Characteristics of Alumina-Glass Composite Multi-Layer Substrates with Co-fired Copper Conductors (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functioions and Size-Reductions)
- Low-Temperature Reactive Ion Etching for Multi-Layer Resist (Special Issue on Sub-Half Micron Si Device and Process Technologies)
- Mechanism for AlSiCu Alloy Corrosion
- Temperature Dependence of Gain Characteristics in 1.3-μm AlGaInAs/InP Strained Multiple-Quantum-Well Semiconductor Lasers (Joint Special Issue on Recent Progress in Optoelectronics and Communications)
- Temperature Dependence of Gain Characteristics in 1.3-μm AlGaInAs/InP Strained Multiple-Quantum-Well Semiconductor Lasers (Joint Special Issue on Recent Progress in Optoelectronics and Communications)
- An 80-MOPS-Peak High-Speed and Low-Power-Consumption 16-b Digital Signal Processor
- A 16-bit Digital Signal Processor with Specially Arranged Multiply-Accumulator for Low Power Consumption
- Analyses on Monolithic InP HEMT Resistive Mixer Operating under Very Low LO Power
- Automated Millimeter-Wave On-Wafer Testing System (Special Issue on Microwave and Millimeter Wave Technology)
- A 600 mW Single Chip MPEG2 Video Decoder