熱伝導実験用食材モデル系の力学的性質に及ぼす水分量および温度の影響

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The mechanical properties of a series of food models in a previous work for examining the thermal conduction of foodstuffs during heating were compared with the new food models in which wheat flour in the solid phase had been substituted by wheat starch granules. The moisture content in each food model could be controlled in the range of 7-50 wt% without any fracture in the moulded shape during heating. The instantaneous elasticity in the highly moisturized models under small deformation against constant stress expressed a maximum value at around 70℃ due to gelatinization of the starch component. The viscosity of the models containing more than 40 wt% of moisture in the liquid phase, as estimated by the creep curve against constant stress, increased at a temperature higher than 50℃, reflecting gelatinization of the starch component. Apparent brittle fracture is apparent during the stress response against large deformation in each model with less than 20 wt% moisture in the liquid phase, while pseudo-ductility appears in all the model systems with more than 40 wt% moisture in the liquid phase. The thermal conductivity of the new food models was identical with that of the previous models, i.e. the thermal conductivity of each model incresed with increasing moisture content without any influence from measuring temperature in the range from 30 to 80℃. The moulded shape of the prepared models may have been brought about by the amphiphilic property of the pure cocoa component in the solid phase of each model, so that both water and corn oil in the liquid phase of the models would be homogeneously mixed with the solid components according to the surface activity of pure cocoa.
2004-07-15

熱伝導実験用食材モデル系の力学的性質に及ぼす水分量および温度の影響

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