高密度低結合度ラッピング砥石の開発とその硬脆材料の鏡面研磨への応用

概要

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High concentration of active grains and low bonding strength are important features for the increase of the removal rate and the reduction of the subsurface damage in lapping of brittle materials. Thus, high-concentration lapping discs with low bonding strength have been developed. First, the finishing characteristics using the lapping discs were investigated, varying the concentration of bonding agents and thereby determining that a high removal rate could be obtained at a small concentration. Next, soft abrasives which might have a mechanochemical reaction with workpiece materials were adopted as the abrasive material of the lapping discs, and colloidal silica which might have a mechanochemical reaction with workpiece materials was applied as a coolant in finishing. A mirror-surface finish of less than 10 nmRa was obtained for various brittle materials, and a smooth -surface finish with no dropping-out of grains was achieved for aluminum-nitride substrates.
社団法人日本機械学会の論文
1991-10-25