紫外線硬化性樹脂を用いたレジンボンドダイヤモンドワイヤ工具の開発

概要

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A recent technological trend in semiconductor industries is the use of large (i.e. 8" or 300mm diameter) silicon wafers to improve the productivity and reduce the cost of silicon devices. The ID-blade traditionally being used for slicing silicon ingots, deteriorates the through-put when used for slicing large ingots. Wire sawing technology, therefore, has attracted attention and is now replacing the ID-blade slicing technology. Wire sawing with loose abrasives is widely employed today, but the process has problems relating to dirty working environment and low efficiency. Fixed-abrasive wire sawing using resinoid diamond wire tools has been developed for overcoming these problems, but the tools still have the problem of high production cost because thermosetting resin, which requires long time to be cured, is used as the bonding material. As the result, the diamond wire tool cannot be put to practical use. In this study, ultraviolet curing resin, which can be cured in short time, is used as the bonding material of a resinoid diamond wire tool to solve the problem. A series of experiments revealed that a newly developed wire tool can be manufactured at low cost and has a good mechanical property and a good machining performance.
公益社団法人精密工学会の論文
2002-11-05