アルカリ粉末を添加したシリカ砥粒研磨パッドの開発(機械要素,潤滑,工作,生産管理など)

概要

論文の詳細を見る
Polishing processes of silicon wafers have been traditionally carried out utilizing colloidal silica slurry on a polishing pad. It causes the bad working environment and the high total polishing cost. A pad with fixed ultrafine silica has been developed to solve these problems. However, it still has the problem of too low removal rate as a polishing pad. In this study, a new fixed-abrasive tool which applies aggregate silica grains and adds alkaline powders into the pad is developed. Instead of conventional abrasive slurry, a slurry-free polishing could be performed by only supplying D. I. water. The experiments have been carried out on silicon wafers. As a result, compared with the traditional slurry process, higher removal rate and better finishing roughness could be obtained. Moreover, it could be possible to obtain the constant supply of alkaline and the constant polishing rate by coating of alkaline powders.
2004-02-25