研磨パッドを用いない鏡面研磨法の提案 : 複合粒子研磨法の開発(機械要素,潤滑,工作,生産管理など)

概要

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A polishing pad has so far been indispensable in conventional polishing method for most industrial materials. However, many problems, such as wear and glazing of pad surface, variation in removal rate over time, poor repeatability and difficulty in process control, and necessity of in-situ conditioning of pad surface, remain to be solved. A mirror polishing method using no polishing pad is therefore proposed, in which polymer particles are supplied together with abrasive grains on to a tool plate that could be made of hard materials. The polymer particles serve as countless micropads in the work-to-plate gap for polishing action, as well as spacers preventing contact between the tool plate and the workpiece. The feasibility of this method has been verified through polishing experiment of silicon wafers. Higher removal rate of material and higher form accuracy, easier process control and higher stability at less polishing resistance, and hence lower power consumption have been obtained than using a polishing pad. Also it is found that the properties of polymer particles and the surface roughness of tool plate have very important effects on polishing characteristics.
社団法人日本機械学会の論文
2002-10-25