416 複合粒子研磨法 : 小径キャリア粒子の適用(OS15 研磨技術)

概要

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For the purposes of investigation of size effects on polishing performance and characteristics of polished surfaces as well as optimization of Four-Body Finishing process, instead of the 10μm polymer particles that have been used in general, smaller polymer particles, 2 to 4μm in diameter, were employed in polishing experiment with silicon wafers. The results showed that, at the same polymer particles concentration.in slurry, higher removal rates, much smaller edge profile PV values, lower Roughness (Ra) and Waviness (Wa) can be realized with small polymer particles than large ones. Furthermore, using small polymer particles produced higher ratios of motor torque over removal rate, which means, better power efficiency in material removal. These advantages are attributed to much more working points, smaller material removal unit by smaller particles and compacter layer structure of the polymer particles.
社団法人日本機械学会の論文
2004-11-19