B36 多孔質エポキシ樹脂研磨パッドの材料特性とガラスの研磨特性(OS10 研磨技術(1))

概要

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Cerium is one of rare metals to have high risk so that it is strongly required to reduce the usage quantity. As the usage of cerium, the ratio used as an abrasive grain is high. Cerium oxide is a polishing agent of glass to use commonly. Then we started the research project to improve the removal rate. When an epoxy-resin polishing pad was employed instead of an urethane polishing pad, it was found that the removal rate exceeded the twice of conventional polishing. In this paper the reason of high removal rate was investigated. As the result dynamic friction coefficient of epoxy-resin polishing pad was extremely high in wet state so that abrasive grain was difficult to move. The inclination experiment confirmed that it was difficult to flow the slurry on the epoxy pad. Next an alternative abrasive was examined. Commercial zirconia abrasive grain had the possibility to become a substitute abrasive when epoxy resin pad was used as a polishing pad.
2010-11-19