超微細砥粒の電気泳動現象を利用したシリコンウェーハのインフィード研削

概要

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The application of electrophoretic deposition of ultrafine abrasives to grinding cut-off has enabled both no chipping and a mirror surface finish to be achieved using the developed aluminum-bonded diamond blades. Then we examined its application to infeed grinding of silicon wafers to replace the lapping process. A series of experiments clarified that desiccation due to electroosmosis caused agglomeration of adhered abrasives onto the grinding wheel, and that easy dropping-off of the agglomerates caused numerous scratches. Both the increase of viscosity of grinding fluid by the addition of a thickener and the decrease of applied voltage were performed to restrain electroosmosis, which enabled a mirror surface finish of 23 nmRt with no scratches to be achieved.
社団法人日本機械学会の論文
1998-09-25