高密度マイクロ視覚モジュール 3 次元実装技術

概要

論文の詳細を見る
Advanced three dimensional assembly technology for a high density CCD micro-camera system module has been developed by applying the module sidewall interconnection method. A copper wiring layer at the edge of the stacked substrates is exposed so that the footprint achieves sidewall interconnection. Devices of different sizes, each of which consists of CCD imaging data transmission circuits, are assembled by flip-chip technology on the stacked unit substrates. The high precision of distribution for the sidewall was achieved in order to make possible simultaneous stacking of plural substrates and application of Cu column solder bump for flip-chip interconnection. The fabricated three-dimensional module incorporates devices of different sizes and realizes the assembly density three times higher than that of a conventional module.
社団法人エレクトロニクス実装学会の論文
2000-03-01