Junction Temperature and Thermal Resistance Measurement in High-Power Light Emitting Diodes Using A Real-Time Diode Forward Voltage Sampling Technique
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概要
- 論文の詳細を見る
- 2006-09-13
著者
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Wang Shui-jinn
Institute Of Microelectronics Dept. Of Electrical Eng. National Cheng Kung Univ.
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Liou Bor-wen
Department Of Computer Science And Information Engineering Wu-feng Institute Of Technology
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Yang Su-hua
National Kaohsiung University Of Applied Sciences Department Of Electronic Engineering
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CHEN Tron-Min
Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University
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UANG Kai-Ming
Dept. of Electrical Eng., Wu-Feng Institute of Technology
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CHEN Shiue-Lung
Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University
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KUO Der-Ming
Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University
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KUO Hon-Yi
Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University
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LIOU Bor-Wen
Dept. of Computer Science and Information Eng., Wu-Feng Institute of Technology
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Kuo Hon-yi
Institute Of Microelectronics Dept. Of Electrical Eng. National Cheng Kung Univ.
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Chen Shiue-lung
Institute Of Microelectronics Dept. Of Electrical Eng. National Cheng Kung Univ.
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Wang Shui-jinn
Institute Of Microelectronics Department Of Electrical Engineering National Cheng Kung University
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Chen Tron-min
Institute Of Microelectronics Dept. Of Electrical Eng. National Cheng Kung Univ.
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Uang Kai-ming
Dept. Of Electrical Eng. Wu Feng Institute Of Technology
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Kuo Der-ming
Institute Of Microelectronics Department Of Electrical Engineering National Cheng Kung University
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