Kim Yong | Memory R&d Division Hynix Semiconductor Inc.

スポンサーリンク

概要

関連著者

もっと見る

著作論文

Diffusion Barrier Characteristics of TiSix/TiN for Tungsten Dual Poly Gate in DRAM
Degradation of Nitride/W/WN_x/Poly-Si Gate Stack by Post-Thermal Processes
Effect of Post Thermal Processes on Nitride/W/WN_x/poly-Si Gate Stack
Effect of Gate Oxide Thickness Uniformity on the Characteristics of Three-dimensional Transistors
Gate Oxide Reliability Characterization of Tungsten Polymetal Gate with Low-Contact-Resistive WSix/WN Diffusion Barrier in Memory Devices
Roles of Ti, TiN, and WN as an Interdiffusion Barrier for Tungsten Dual Polygate Stack in Memory Devices
Effect of Selective Oxidation Conditions on Defect Generation in Gate Oxide
Impact of In Situ NH3 Preannealing on Sub-100 nm Tungsten Polymetal Gate Electrode during the Sealing Nitride Formation

スポンサーリンク