G1001-5-1 電子スペックルパターン干渉法を用いた低温領域における板材の熱膨張率の測定((5)計測・測定)

概要

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The space development advances and the structure such as satellites has increased in recent years. There is change of temperature between -100[K] and +100[K] under such an environment. Therefore, the coefficient of thermal expansion is very important amount of physical properties one in the selection of the solid-state material, the design of the equipment, and the scene of the performance forecast etc. Then, it paid attention to the Electronic Speckle Pattern Interferometry that was one of the optical determination in this study. The thermal expansion coefficient of rectangular shaped specimens at low temperatures was measured by ESPI (Electronic Speckle Pattern Interferometry). The specimen was able to measure the coefficient of thermal expansion of stainless steels and aluminum by using stainless steels, aluminum, and the Poly Tetra Fluoro Ethylene.
2009-09-12