ホログラフィック光学素子による多点同時はんだ付け(S55-1 レーザ加工(1),S55 レーザ加工)

概要

論文の詳細を見る
Until now, laser soldering has been performed by scanning of a laser beam on solder areas. However, in this method, tomb stoning and jointed chip components with a lean were induced. The deterioration of mechanical reliability was caused by these problems. Furthermore, on the complicated circuit boards and shapes of joining point, laser soldering has been detrimental. Here we propose the multi-spot simultaneous laser soldering by use of Holographic Optical Element (HOE). In the early stage, HOE which allows the two-spot simultaneous laser soldering was designed and fabricated. And samples which were soldered two-spot simultaneously by use of HOE were compared with samples which were soldered in the scanning method
一般社団法人日本機械学会の論文
2004-09-04