3561 金系はんだのナノレベル組織解析と力学的特性評価(S23-2 弾性・塑性・粘塑性特性,S23 電子実装用はんだの強度特性評価)

概要

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Au solders have been used for micro joints of electronic packaging where high reliability is required. However, data on mechanical properties of Au solders is very limited because the material is too expensive to make bulk tensile specimens. Especially, creep properties of Au solders have not been examined. We carried out indentation creep tests at various temperatures at R.T., 323K, 373K, 398K and 423K for Au-20Sn and Au-12Ge solders. It was found that creep deformation existed at room temperature for Au-20Sn, while it was seen above 373K for Au-12Ge. Plastic anisotropy of Au-12Ge was evaluated by dent shape. Nano-indentation tests were performed in order to investigate influence of each phases of Au-20Sn on creep deformation.
社団法人日本機械学会の論文
2006-09-15