836 Sn-Ag-Cu-Bi はんだの力学特性の温度依存性

概要

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A convenient method for predicting mechanical properties of solder materials was proposed in this study. Indentation method was used to obtain mechanical properties including elastic, plastic and creep deformations. Elastic-plastic finite element method (FEM) correlated Young's modulus, E, and yield stress, σ_<ys>, with unloading portion of load-displacement curve and Vickers hardness, HV, respectively. Tensile creep properties were lead by measured indentation creep properties, where the creep properties were evaluated by the Norton's law. The above prediction methods established in our previous work are based on elastic-plastic-creep analysis of FEM for a indenter with rotational symmetry, whereas the Vickers indenter is a 3-dimentional configuration of quadrangular pyramid. The agreement of the prediction methods was confirmed by 3-dimentional analysis of FEM. Some other factors, which influence the prediction methods, were investigated by 2-dimentional analysis of FEM. Using the proposed method, mechanical properties of lead-free solders such as Sn-3.5Ag and Sn-3Ag-0.5Cu-0∿3Bi alloy systems were determined for the temperature between -20℃ and 160℃.
社団法人日本機械学会の論文
2002-09-20