OS0507 高純度ALボンディングワイヤの力学特性評価(微視構造を有する材料の変形と破壊,オーガナイズドセッション)

概要

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Recently, electronic devices become smaller and lighter, and micro-materials, e.g. solders and bonding wires, have been used for these devices. Studies on micro-materials are essential to improve safety and reliability of the electronic devices. However, enough work has not been done to evaluate specific mechanical properties of micro-materials. In this study, original tensile testing machine was developed for ultra fine wires, whose mechanical properties were measured. Tensile tests and creep tests were carried out for the fine wires of high-purity aluminum with the diameter of 100 and 400 1m. These tests were carried out for as-received and annealed specimens in order to investigate the effect of the crystal grain size on mechanical properties. After the tests, the specimens were observed by SEM and investigated fracture mechanism of specimens. The result showed that the size effects and the temperature dependence were attributed to the relationships between the grain size and the wire diameter of the fine wires.
2009-07-24