1846 鉛フリーはんだのクリープ特性に及ぼす寸法の影響(J09-2 はんだ接続部の強度信頼性評価,J09 電子情報機器,電子デバイスの熱制御と強度・信頼性評価)

概要

論文の詳細を見る
Soldered joints in the electronic devices became small down to the sizes of several tens of μm. However, creep test has been carried out using bulk specimens with the diameters between 6 and 10mm. The size effect on creep properties for bulk specimen and micro order soldered joints should be considered for evaluating the integrity of electric devices. In this study, we carried out creep tests using fine wire solders with the diameters of 0.3, 0.5 and 1.0mm. Creep tests were performed using our original creep testing machine for fine wire solders. It was clarified that stress exponent and creep rate of wire solders in Norton's low were different from those of bulk specimens.
社団法人日本機械学会の論文
2005-09-18