1104 半導体パッケージの熱サイクル負荷による反り変形増大メカニズムの解明(J08-2 電子情報機器,電子デバイスの強度・信頼性評価と熱制御(2) 半導体・界面接合,ジョイントセッション,21世紀地球環境革命の機械工学:人・マイクロナノ・エネルギー・環境)

概要

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Copper base have been used for many semiconductor package to satisfy thermal radiation performance. However, copper base easily curvature deformed and deformation increases during thermal cycle. In this research, the increase mechanism of copper base deformation during heat cycle is clarified using experimental approach and fmite element analyses. As a result, this phenomenon occurs as a interaction with plastic deformation of copper base at low temperature and a stress relaxation due to solder creep at high temperature. The results of fmite element analysis that considers plasticity of copper and creep deformation of solder joint agree well with experimental result under same thermal cyclic conditions.
2008-08-02