J0601-3-4 半導体用伝熱グリースのポンピングアウト現象の定量評価([J0601-3]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(3))

概要

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In semi-conductor modules and packages, thermal grease is applied as the heat transfer medium between the heatsink and heat generating section. Sometimes, thermal grease move and flowing out from initial application position during operation. This phenomenon occurs by grease pump-out due to repetitive warpage of semiconductor module. In this research, the accelerated test method is developed to determine interface condition due to prevent pump-out. The vertical movement distance of thermal grease was quantitatively evaluated in vertical application condition. As a result, movement distance of grease is depend on amplitude of warpage and thermal condition. As a warpage deformation and testing temperature increase, the movement distances increases. In addition, displacement rate is correlated with apparent viscosity of several greases.
2010-09-04