1213 インデンテーション法による電機製品の機械物性評価 : 第1報弾塑性クリープ特性の評価精度検証(OS12-4 実験・計測における先端技術とその応用-材料特性評価-)

概要

論文の詳細を見る
Electronic devices have reduced size, complex structure and contain various materials. Therefore, evaluation of the mechanical properties of electronic devices faces mounting difficulties. Recently, some mechanical properties such as elastic, plastic and creep deformations are predicted by indentation method. It is suitable method for small electronic devices. In this study, mechanical properties of solder which are commonly used for electric devices, are measured by indentation method and verified the accuracy of measurement compaiing with tensile test. As the results, the estimated elastic-plastic properties are in good agreement with tensile test results. Furthermore, the estimated creep properties are in good agreement with tensile creep test results.
一般社団法人日本機械学会の論文
2010-10-09