電界共役流体(ECF)を応用した電子チップ液冷用平面薄形ポンプ(機械要素,潤滑,工作,生産管理など)

概要

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This paper presents a novel liquid cooling concept for heat rejection of high power electronic chips existing in notebook computers etc. In order to realize a liquid cooling system for the electronic chips, such as advanced notebook CPUs, a simple thin-planar pump using electro-conjugate fluid (ECF) is proposed, fabricated, and experimentally investigated. The ECF is a kind of dielectric and functional fluids,which generates jet flows (ECF-jets) by applying static electric field through a pair of rod-like electrodes. The ECF-jet directly acts on the working fluid, so the proposed planar ECF pump needs no moving part, produces no vibration and noise. The experiments of the fabricated thin-planar ECF pump with A 4 size were performed with four different flow channel heights and seven different electrode patterns. The no-load flow rate of 5.5 cm^3/s, maximum output pressure of 7.1 kPa, and maximum output power of 11.6 mW are obtained at an applied voltage of 2.0 kV. Through the experimental results, the fesibility of the thin-planar ECF pump is confirmed as a power source of the liquid cooling system on advanced notebook computers.
2005-09-25