Novel Bonding Technology for Hermetically Sealed Silicon Micropackage
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 1999-01-15
著者
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Ju Byeong-kwon
Electronic Materials And Devices Research Center Korea Institute Of Science And Technology
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Lee Duck-Jung
Electronic Materials and Devices Research Center Korea Institute of Science and Technology
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Jeong Jee-Won
Electronic Materials and Devices Research Center Korea Institute of Science and Technology
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Jang Jin
Department of Physics, Kyunghee University Hoigi-dong
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Oh Myung-Hwan
Electronic Materials and Devices Research Center Korea Institute of Science and Technology
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CHOI Woo-Beom
Electronic Materials and Devices Research Center, Korea Institute of Science and Technology
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LEE Yun-Hi
Electronic Materials and Devices Research Center, Korea Institute of Science and Technology
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LEE Kwang-Bae
Department of Physics, Sangji University
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Oh Myung-hwan
Electron Devices Research Centre Korea Institute Of Science And Technology( Kist )
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Jang Jin
Department Of Biochemistry School Of Medicine Kyungpook National University
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Lee Y‐h
Samsung Electronics Co. Ltd. Kyungki‐do Kor
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Choi W‐b
Korea Univ. Seoul Kor
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Lee Yun-hi
Electronic Materials And Devices Research Center Korea Institute Of Science And Technology
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Lee Y‐h
Faculty Of Physics Korea Advanced Institute Of Science And Technology
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Jang J
Kyunghee Univ. Seoul Kor
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Jang J
Korea Institute Of Science And Technology
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Lee Kwang-bae
Department Of Physics Sangji University
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JU Byeong-Kwon
Electronic Materials and Devices Research Center, Korea Institute of Science and Technology
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OH Myung-Hwan
Electronic Materials and Devices Research Center, Korea Institute of Science and Technology
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JANG Jin
Department of Physics, Kyunghee University
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JEONG Jee-Won
Electronic Materials and Devices Research Center, Korea Institute of Science and Technology
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LEE Duck-Jung
Electronic Materials and Devices Research Center, Korea Institute of Science and Technology
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