JU Byeong-Kwon | Electronic Materials and Devices Research Center, Korea Institute of Science and Technology

スポンサーリンク

概要

• 同名の論文著者
• Electronic Materials and Devices Research Center, Korea Institute of Science and Technologyの論文著者

関連著者

• Ju Byeong-kwon

  Electronic Materials And Devices Research Center Korea Institute Of Science And Technology

• Lee Duck-Jung

  Electronic Materials and Devices Research Center Korea Institute of Science and Technology

• Jeong Jee-Won

  Electronic Materials and Devices Research Center Korea Institute of Science and Technology

• Jang Jin

  Department of Physics, Kyunghee University Hoigi-dong

• Oh Myung-Hwan

  Electronic Materials and Devices Research Center Korea Institute of Science and Technology

• CHOI Woo-Beom

  Electronic Materials and Devices Research Center, Korea Institute of Science and Technology

• LEE Yun-Hi

  Electronic Materials and Devices Research Center, Korea Institute of Science and Technology

• LEE Kwang-Bae

  Department of Physics, Sangji University

• Oh Myung-hwan

  Electron Devices Research Centre Korea Institute Of Science And Technology( Kist )

• Jang Jin

  Department Of Biochemistry School Of Medicine Kyungpook National University

• Lee Y‐h

  Samsung Electronics Co. Ltd. Kyungki‐do Kor

• Choi W‐b

  Korea Univ. Seoul Kor

• Lee Yun-hi

  Electronic Materials And Devices Research Center Korea Institute Of Science And Technology

• Lee Y‐h

  Faculty Of Physics Korea Advanced Institute Of Science And Technology

• Jang J

  Kyunghee Univ. Seoul Kor

• Jang J

  Korea Institute Of Science And Technology

• Lee Kwang-bae

  Department Of Physics Sangji University

• JU Byeong-Kwon

  Electronic Materials and Devices Research Center, Korea Institute of Science and Technology

• OH Myung-Hwan

  Electronic Materials and Devices Research Center, Korea Institute of Science and Technology

• JANG Jin

  Department of Physics, Kyunghee University

• JEONG Jee-Won

  Electronic Materials and Devices Research Center, Korea Institute of Science and Technology

• LEE Duck-Jung

  Electronic Materials and Devices Research Center, Korea Institute of Science and Technology

もっと見る 閉じる

著作論文

• Novel Bonding Technology for Hermetically Sealed Silicon Micropackage

スポンサーリンク