Vacuum Packaging using Anodic Bonding and Emission Characteristics of FED
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概要
- 論文の詳細を見る
In this paper, we suggest the FED packaging technology using anodic bonding method. Amorphous silicon film deposited on glass was contacted with glass substrate followed by bonded. Glass-glass bonding is based on conventional silicon-glass bonding mechanism and achieved successfully. The FED panel having opened exhausting hole was formed by glass frit process and sealed by capping glass. From the leak test in a bonded interface, the inner pressure of panel was kept continuously during pumping out. A light emission was observed from the packaged 0.7-inch FED, then anode current was 34μA. Emission stability was constantly measured for 11 hours.
- 社団法人電子情報通信学会の論文
- 1999-03-18
著者
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Ju Byeong-kwon
Electronic Materials And Devices Research Center Korea Institute Of Science And Technology
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Lee Duck-Jung
Electronic Materials and Devices Research Center Korea Institute of Science and Technology
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Jeong Jee-Won
Electronic Materials and Devices Research Center Korea Institute of Science and Technology
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Kim Hoon
Electronic Materials and Devices Research Center Korea Institute of Science and Technology
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Jung Sung-Jae
Orion Electric Co.Ltd.
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Jang Jin
Department of Physics, Kyunghee University Hoigi-dong
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Oh Myung-Hwan
Electronic Materials and Devices Research Center Korea Institute of Science and Technology
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Jang J
Kyunghee University
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Oh Myung-hwan
Electron Devices Research Centre Korea Institute Of Science And Technology( Kist )
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Jang Jin
Department Of Physics Kyunghee University
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Jang Jin
Department Of Biochemistry School Of Medicine Kyungpook National University
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Jung Sung-jae
Orion Electric Co. Ltd.
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Jang J
Kyunghee Univ. Seoul Kor
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Jang J
Korea Institute Of Science And Technology
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Kim H
Information And Communications University (icu):(present Address)samsung Advanced Institute Of Techn
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