1019 逐次 2 点法によるシリコン基板の平面度測定に関する研究(第 2 報) : 静圧支持系他の安定化による高精度測定

概要

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Flatness measurement of Si substrate with higher form accuracy less than 1-micron meter is attempted and conducted in terms of Sequential-Two-Points Method (STPM). In the utilized apparatus the substrate is supported by hydrostatic rotating bearing and the cantilever which installs sensors is floated and driven by the hydrostatic bearing as well in rectilinear motion along the radial direction. The investigation proves that the method can be stably applied to the case that both the sensors and the objective are dynamically supported. In the application made so far either of the sensors or the objective was fixed. The results of the measurement show that the straightness form accuracy along radial direction can be obtained by accuracy of several tenths of 1-micron meter. They show that the form accuracy can be easily varied by supporting conditions for the substrate.
社団法人日本機械学会の論文
2002-03-14