Characteristics under Bias-Temperature-Stress of Cu/Low-k a-SiCO: H Structures Prepared by Plasma Enhanced Chemical Vapor Deposition Using a Hexamethyldisilane Precursor and Cu Sputtering
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概要
- 論文の詳細を見る
- Japan Society of Applied Physicsの論文
- 2003-08-01
著者
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Yang Jinfeng
Sumitomo Heavy Industries Ltd.
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Yang J
Department Of Ee University Of South Carolina
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Jung D
Sungkyunkwan Univ. Suwon Kor
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Jung Donggeun
Department Of Physics Brain Korea 21 Physics Research Division Institute Of Basic Science And Center
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Jung Donggeun
Department Of Physics And Institute Of Basic Science Sungkyunkwan University
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SHIM Cheonman
Department of Physics, Brain Korea 21 Physics Research Division, Institute of Basic Science, and Cen
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YANG Jaeyoung
Department of Physics, Brain Korea 21 Physics Research Division, Institute of Basic Science,and Cent
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CHOI Munkyu
Department of Physics, Brain Korea 21 Physics Research Division, Institute of Basic Science,and Cent
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Choi Munkyu
Department Of Physics Brain Korea 21 Physics Research Division Institute Of Basic Science And Center
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Yang Jaeyoung
Department Of Physics Brain Korea 21 Physics Research Division Institute Of Basic Science And Center
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Shim Cheonman
Department Of Physics Brain Korea 21 Physics Research Division And Institute Of Basic Science Sungky
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Yang J
Ipec
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Shim C
Sungkyunkwan Univ. Suwon Kor
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