溶融法を用いたフレキシブルデバイス作製法と力学的評価

概要

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The mechanical properties of organic field-effect transistors (OFET) fabricated by the thermal press method are evaluated for improving performance of flexible electronic devices. The thermal press method is a novel one to fabricate organic semiconductor devices without any toxic solvents which may cause some problems. In the present study, from the mechanical viewpoints, we have pointed out that the thermal press method has the advantages in forming the OFET with a laminated structure and creating new possibilities for developing a variety of the functional devices. The validity of this perception has been demonstrated by numerical simulations. Based on the present results, the laminated structure of the OFET is effective in not only protecting the semiconductor layer, but also increasing the bending stiffness of the OFET. Moreover, it is shown that the thermal press method has the potential to create various types of OFET to improve the functions of the flexible electronic devices.