Reactions of Haloferrocenes. II. Kinetic Studies of the Reaction of Haloferrocene with Copper (I) Chloride - Pyridine Complex
スポンサーリンク
概要
- 論文の詳細を見る
The reaction of bromoferrocene with copper(I) chloride - pyridine complex was found to be second-order, that is, first-order in each of bromoferrocene and copper(I) chloride-pyridine complex. The results obtained from the competitive reactions between bromoferrocene and bromobenzene indicated that bromoferrocene was 10<SUP>3</SUP> times more reactive than bromobenzene in the halogen-exchange reaction. The effects of the pyridine bases on the halogen-exchange reaction of bromoferrocene were examined, and the trend of the results was found to be different from that of bromobenzene. The reason for this was discussed on the basis of the reaction mechanism.
- 公益社団法人 日本化学会の論文
著者
-
Motoyama Izumi
Department Of Applied Chemistry Faculty Of Engineering Kanagawa University
-
Sato Masaru
Department Of Applied Chemistry School Of Advanced Science And Engineering Faculty Of Science And En
-
Hata Kazuo
Department of Chemistry, Faculty of Science, Tokyo Metropolitan University
関連論文
- Expansion Working of Brass Tubes by Plug Drawing
- The Mechanism of Correcting the Eccentricity of Brass Tubes by Sinking
- P-493 Studies on Constituents of Erythrina variegata (Leguminosae)
- A new amide from the leaves and twigs of Litsea auriculata
- Phytochemical Flavones with the Antibacterial Activity against Methicillin-Resistant Staphylococcus aureus
- Thermostable ATP Regeneration System Using Polyphosphate Kinase from Thermosynechococcus elongatus BP-1 for D-Amino Acid Dipeptide Synthesis(BIOCHEMICAL ENGINEERING)
- Substrate Specificity of Thermostable D-Alanine-D-alanine ligase from Thermotoga maritima ATCC 43589
- D-Amino Acid Dipeptide Production Utilizing D-Alanine-D-Alanine Ligases with Novel Substrate Specificity(Enzymology, Protein Engineering, and Enzyme Technology)
- Evaluation of [111]-Textured Cu Layer Formed on Thin Nb Barrier Layer on SiO_2(Session 8A Silicon Devices V,AWAD2006)
- Evaluation of [111]-Textured Cu Layer Formed on Thin Nb Barrier Layer on SiO_2(Session 8A Silicon Devices V)