1706 フローハンダ付け工程のCFDシミュレーション : 斜め方向引き上げの場合(OS17. 電子デバイス・電子材料と計算力学(2),オーガナイズドセッション講演)

概要

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Flow soldering process is one of major soldering process used in the manufacture of electronics. One of the defects in soldering is a bridge, which connects adjacent components and results in a short circuit fault. It is necessary to clarify the conditions under which the bridge occurs. Flow soldering process with a simple model has been studied experimentally and numerically. The purpose of this study is to clarify the relation between the lifting velocity and the solder volume on the joint. The printed circuit board mounted with electronics components is dipped into a solder bath and detached from the bath at constant velocities. The angle between the PCB and the lifting velocity is 20 degree. CFD simulation qualitatively reproduced the experimental result.
2010-09-23