Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS (電子部品・材料)
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概要
- 論文の詳細を見る
This paper presents design and implementation of an inductive coupling power delivery system between stacked chips in 0.18-μm CMOS process. Two conventional high-power rectifier structures are compared, and a new topology is proposed. With a pair of fully optimized 700μmx700μm on-chip inductors, the test chip achieves 10% peak efficiency and 36mW power transmission. Compared with previous published chip-to-chip wireless power transmission systems, the received power is 13 times larger.
- 社団法人電子情報通信学会の論文
- 2008-01-10
著者
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Yuan Yuxiang
Department Of Electrical And Electronic Engineering Keio University
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Yuxiang Yuan
Department Of Electrical And Electronic Engineering Keio University
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Yoshida Yoichi
Department of Electrical and Electronic Engineering Keio University
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Kuroda Tadahiro
Department of Electrical and Electronic Engineering Keio University
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Kuroda Tadahiro
Keio Univ.
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Yoshida Yoichi
Keio University
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Yoshida Yoichi
Keio University Department Of Electronics And Electrical Engineering
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