Chip-to-chip power delivery by inductive coupling with ripple canceling scheme (Special issue: Solid state devices and materials)

スポンサーリンク

概要

• 論文の詳細を見る
• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文

著者

• Yuan Yuxiang

  Department Of Electrical And Electronic Engineering Keio University

• Yamagishi Nobuhiko

  Department Of Electronics And Electrical Engineering Keio University

関連論文

• Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS (電子部品・材料)
• Chip-to-chip power delivery by inductive coupling with ripple canceling scheme (Special issue: Solid state devices and materials)
• Chip-to-Chip Power Delivery by Inductive Coupling with Ripple Canceling Scheme
• Measurement of Inductive Coupling in Wireless Superconnect
• Analysis of Inductive Coupling and Design of Rectifier Circuit for Inter-Chip Wireless Power Link
• Measurement of Inductive Coupling in Wireless Superconnect
• Chip-to-Chip Power Delivery by Inductive Coupling with Ripple Canceling Scheme

スポンサーリンク