Measurement of Inductive Coupling in Wireless Superconnect
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概要
- 論文の詳細を見る
An inductive inter-chip wireless communication scheme in three-dimensional (3D) stacked chip has been reported to achieve high-speed, low-power, and low-cost inter-chip communication. In this scheme, inductive coupling becomes a fundamental of communication and it should be modeled to realize communication. In inter-chip communication, it is considered that eddy current effect and the reflection of electromagnetic field degrade transmission power. However, there is as yet no report on inter-chip inductive coupling showing these effects. In this study, the scattering parameter of inductive coupling in 3D stacked chip has been measured under three conditions. The first measurement is carried out by changing the inductance alignment vertically and horizontally to verify the estimation scheme of coupling coefficient. The second measurement is carried out to evaluate ground mesh effect on inductive coupling. The third measurement is carried out by changing bulk thickness with constant communication distance to evaluate eddy current effect in bulk. The results show that eddy current does not become a problem and power grid degrades communication efficiency.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2006-04-30
著者
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Yoshida Yoichi
Department of Electrical and Electronic Engineering Keio University
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Kuroda Tadahiro
Department of Electrical and Electronic Engineering Keio University
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Yamagishi Nobuhiko
Department Of Electronics And Electrical Engineering Keio University
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Miura Noriyuki
Department Of Electronics And Electrical Engineering Keio University
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Yamagishi Nobuhiko
Department of Electronics and Electrical Engineering, Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama 223-8522, Japan
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Mizoguchi Daisuke
Department of Electronics and Electrical Engineering, Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama 223-8522, Japan
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Yoshida Yoichi
Department of Electronics and Electrical Engineering, Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama 223-8522, Japan
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